E-Beam Boron Doping Source EBVV-B

EBVV-B is a vertical e-beam evaporator that offers evaporation of elemental Boron or Si-B alloy on DN63CF (O.D. 4.5") flange with 4 cm³ crucible capacity.
  • Up to 1021 /ccm Boron doping in Si-MBE
  • Evaporation of elemental Boron or Si-B alloy in vertical e-beam evaporator
  • Small dimensions; can be used in DN63CF (O.D. 4.5“) effusion cell ports; hearth volume 5 cm³
  • Long filament lifetime and easy maintenance
  • 270° beam deflection
  • High frequency x-y-beam deflection system
  • Silicon shielding parts for use in SiGe-MBE  Datasheet

Introduction

EBVV 63-4 close-up view
EBVV-B 63-4 , view onto emitter block and filament
pool of molten silicon
EBVV-B 63-5, pool of molten silicon (EBVV is mounted into a port 35° to the vertical axis)
silicon shielding parts
Set of silicon shielding parts for EBVV-B 63-5
shielding parts
EBVV-B 63-5, with shielding parts

The Vertical Electron Beam Evaporator EBVV-B 63-5 allows to introduce real e-beam evaporation into your MBE system that has originally been designed for effusion cells only.

The unique and extremely compact design permits to install the EBVV-B 63 instead of an ordinary effusion cell on any MBE system having CF63 ports with an I.D. ≥ 60 mm. Even tilted ports can be used. Despite its small footprint, the new EBVV-B 63 includes a complete electromagnetic x- and y-dynamic beam deflection system and can deliver beam powers up to 3 kW.

The evaporator hearth volume is 5 cm³.

The 270° beam deflection design of the electron emitter eliminates nearly all ion bombardment on the filament due to a sharply bent electron beam path near the beam exit aperture. Thus, the filament is well shielded from evaporant or charged particles ejected from the crucible.

Application

The EBVV-B 63-5 allows high purity evaporation of elemental boron or Si-B alloy. Consequently, it allows Si and SiGe MBE growth of highest Boron doped epi-layers with Boron concentrations  up to 1021/ccm.

This concept is applied in Si/SiGe HBTs or Si based Esaki-Diodes with record peak-to valley ratio and current density. The SIMS profile below shows a 275 nm Si layer with high Boron doping.

Silicon shielding parts

The EBVV-B is equipped with a specially adapted set of shielding parts manufactured from high-purity single crystalline Si. A Si plate and a ring cover all parts of the metallic body that are potentially subject to electron or ion bombardment and that face the substrate.

Only this Si-shielding allows the growth of highest purity Boron doped Si and SiGe films.

We also supply high purity Si-B source material in superior quality. It is machined and pre-conditioned from wafer-grade Si-single crystals and high purity Boron, fitting the evaporator hearth.

Technical Data

Mounting FlangeDN63 CF (O.D.4,5“) or DN100 CF (O.D.6“)
In‑vacuum dimensionsL=234-400 mm; D=60 mm
Filamentshort-legged coil of W wire, electron emitting filament
Operating pressure1×10-11 mbar - 1×10-5 mbar
Bakeout temperature200°C (all air side connectors removed)
Cooling / water coolingwater cooling, connectors SwagelokTM
Cooling water flow5 l/min at 4 bar
Crucibles5cm³ Ø 23 mm (12° taper) x 15 mm
OptionsTilted hearth (T); integrated rotary shutter (S)
Power4 - 6 kV
max. 3 kW
Filament currentmax. 25 A at 10V (AC)
Spot size5 mm diameter, approx.
Primary beam deflectionC270° by permanent magnet system
Dymamic beam deflectioncoils wound from KAPTON® isolated wire
x-deflection current: ± 1.5 A; y-deflection current: ± 2 A;
deflection frequency: max. 150 Hz